Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate

Product Details
Customization: Available
Application: Electronic Ceramic
Material: Alumina Ceramic
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Registered Capital
5000000 RMB
Plant Area
1001~2000 square meters
  • Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate
  • Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate
  • Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate
  • Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate
  • Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate
  • Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate
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  • Overview
  • Product Description
  • Detailed Photos
  • Product Parameters
  • Certifications
  • Packaging & Shipping
  • Our Advantages
  • FAQ
Overview

Basic Info.

Model NO.
ACS 056
Classify
Insulating Ceramics
Composition
99% 99.6% 99.7% Alumina
Usage
Wear-Resisting Material
Certificate
CE ISO
Application Field
Semiconductors, Aerospace, etc
Type
Ceramic Part, Ceramic Parts
Transport Package
15*12*10cm
Specification
Irregular shape
Trademark
FIST
Origin
China Jiangsu

Packaging & Delivery

Package Size
18.00cm * 12.00cm * 9.00cm
Package Gross Weight
15.000kg

Product Description

Product Description

Introduction:
Product name:Alumina Ceramic Sheet  Alumina  Ceramic Substrate 
Place of Origin:JIANGSU,CHINA
Brand Name:FIST
Material:Alumina ceramic
Color:White
Size:Customzied
Design:according to the customer's request



Usage:
High-power power semiconductor module; Semiconductor refrigerator, electronic heater; Power control circuit, power hybrid circuit.
Intelligent power module; High frequency switching power supply, solid state relay.
Automotive electronics, aerospace and military electronic components.
Solar panel components; Telecommunications private exchange, receiving system; Laser and other industrial electronics.

Detailed Photos

Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate
Ceramic substrate refers to copper foil at high temperature directly bonded to aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate surface (single or double) special process plate. The ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent soft brazing property and high adhesion strength, and can etch all kinds of graphics just like PCB board, with great current carrying capacity. Therefore, ceramic substrate has become the basic material of high power electronic circuit structure technology and interconnection technology.
 




 

Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate
Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate

 

Our company has strong processing capabilities. We provide various raw materials, sizes, shapes, and thicknesses of bare ceramic substrates.

Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate
Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate
Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate


Display of some advanced equipment in our factory

Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate

 

Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate
Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate

 

Product Parameters

96% Alumina Ceramic Substrate
Item Unit 96% Al2O3
Mechanical Properties
Color / / White
Density Drainage Method g/cm3 3.70
Light Reflectivity 400nm/1mm % 94
Flexural Strength Three Point Bending MPa >350
Fracture Toughness Indentation Method MPa·m1/2 3.0
Vickers Hardness Load 4.9N GPa 14
Young's Modulus Stretching Method GPa 340
Water Absorption    % 0
Camber / Length‰ T≤0.3: 5, Others: ≤3‰
Thermal Properties
Max. Service Temperature (Non-loading) / ºC 1200
CTE (Coefficient of
Thermal Expansion)
20-800ºC 1×10-6/ºC 7.8
Thermal Conductivity 25ºC W/m·K >24
Thermal Shock Resistance 800ºC 10 Times No Crack
Specific Heat 25ºC J/kg·k 750
Electrical Properties
Dielectric Constant 25ºC, 1MHz / 9.4
Dielectric Loss Angle 25ºC, 1MHz ×10-4 3
Volume Resistivity 25ºC Ω·cm 1014
Dielectric Strength DC KV/mm 15

Certifications

Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate

Packaging & Shipping

Semiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet SubstrateSemiconductor Thin Ceramic Parts 96% 99.6% Alumina Ceramic Sheet Substrate

 

Our Advantages

1. We support OEM and ODM;
2.
Timely response to your inquiry, multiple choice recommendations based on your demand, quickly respond mails and provide solutions;
3.Provide sample and trial order are accepted for the quality evaluation;
4.Arrange production on time and control quality strictly;
5. Book the earliest vessel or plane to guarantee the delivery time;
6. Provide all the detailed news and pictures from order to delivery;
Offer relative export documents and original certificate if needed;
7. Warm and considerable after-sale service.

FAQ

Q: How long is your delivery time?
A: Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock or customeriziation, it is according to quantity.
Q: How about the payment terms?
A: T/T or L/C are okay. We can negotiate.
Q: How can you get quotation?
A: Please kindly send me your drawing with technical requirement and demand quantity.
If you don't have the drawing,please kindly courier samples to us.We will quote our best price as soon as possible.

Q: How about the shipping&package?
A: The package usually includes bubble wrap, carton, pallent, wooden case, etc. The shipping mode includes express, air and sea transportation. Both we can negotiate and choose the best way.
 

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