Aluminum Nitride White 96% 99.6% Aluminum Oxide Al2O3 Ceramic Substrate

• Application: Electronic Ceramic
• Type: Ceramic Parts
• Classify: Insulating Ceramics
• Shipping Cost: Estimated freight per unit.: about shipping cost and estimated delivery time.
• Currency: US$
• Return&refunds: You can apply for a refund up to 30 days after receipt of the products.
• Model NO.: ACS 01
• Composition: 99% 99.6% 99.7% Alumina
• Usage: Wear-Resisting Material
• Certificate: CE ISO
• Application Field: Semiconductors, Aerospace, etc
• Model No.: Acs 01
• Base Material: Alumina Ceramic
• Product Name: Alumina Ceramic Substrate
• Rycolor: White, Ivory
• Max Working Temperature: 1600c
• Features: High Mechanical Strength, Small Dielectric Loss
• Forming Method: Tape Casting
• Thickness Tolerance: 0.03/0.05mm (Depending on Thickness)
• Material: Alumina Ceramic
• Transport Package: 15*12*10cm
• Specification: Irregular shape
• Trademark: Fist
• Origin: China Jiangsu
• HS Code: 8547100000
• Package Size: 30.00cm * 17.00cm * 12.00cm
• Package Gross Weight: 22.000kg

Product Description

Product Description

Ceramic substrate is a commonly used electronic packaging substrate material. Compared with plastic and metal substrates, ceramic substrate has the following advantages:

1) Good Insulation
Generally speaking, the higher substrate resistance, the better reliability of the package. Ceramic materials are generally covalent bond compounds with better insulation properties.

2) Low Dielectric Coefficient and Good Frequency Performance
The low dielectric constant and dielectric loss of ceramic materials can reduce the signal delay time and increase the transmission speed.

3) Small Coefficient of Thermal Expansion (CTE)
Covalent bond compounds generally have high melting point, and the higher the melting point, the smaller the thermal expansion coefficient, so the CTE of ceramic materials is generally small.

4) High Thermal Conductivity
Ceramic substrate materials are widely used in high-reliability, high-frequency, high-temperature resistance, and strong air-tight product packaging in aviation, aerospace and military engineering. The packaging of ceramic substrate materials is generally a multilayer ceramic substrate package, which is widely used in hybrid integrated circuit (HIC) and multi-chip module (MCM) ceramic packages.

Detailed Photos

Ceramic substrate refers to copper foil at high temperature directly bonded to aluminum oxide (Al2O3) or aluminum nitride (AlN) ceramic substrate surface (single or double) special process plate. The ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent soft brazing property and high adhesion strength, and can etch all kinds of graphics just like PCB board, with great current carrying capacity. Therefore, ceramic substrate has become the basic material of high power electronic circuit structure technology and interconnection technology.
 

 

Usage:
High-power power semiconductor module; Semiconductor refrigerator, electronic heater; Power control circuit, power hybrid circuit.
Intelligent power module; High frequency switching power supply, solid state relay.
Automotive electronics, aerospace and military electronic components.
Solar panel components; Telecommunications private exchange, receiving system; Laser and other industrial electronics.

 

 

Our company has strong processing capabilities. We provide various raw materials, sizes, shapes, and thicknesses of bare ceramic substrates.
 

Display of some advanced equipment in our factory



 

 

Product Parameters

Alumina Ceramic Substrate
Item	Unit		96% Al2O3	99.6% Al2O3
Mechanical Properties
Color	/	/	White	Ivory
Density	Drainage Method	g/cm^3	≥3.70	≥3.95
Light Reflectivity	400nm/1mm	%	94	83
Flexural Strength	Three Point Bending	MPa	>350	>500
Fracture Toughness	Indentation Method	MPa·m^1/2	3.0	3.0
Vickers Hardness	Load 4.9N	GPa	14	16
Young's Modulus	Stretching Method	GPa	340	300
Water Absorption		%	0	0
Camber	/	Length‰	T≤0.3: ≤5‰, Others: ≤3‰	≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)	/	ºC	1200	1400
CTE (Coefficient of Thermal Expansion)	20-800ºC	1×10^-6/ºC	7.8	7.9
Thermal Conductivity	25ºC	W/m·K	>24	>29
Thermal Shock Resistance	800ºC	≥10 Times	No Crack	No Crack
Specific Heat	25ºC	J/kg·k	750	780
Electrical Properties
Dielectric Constant	25ºC, 1MHz	/	9.4	9.8
Dielectric Loss Angle	25ºC, 1MHz	×10^-4	≤3	≤2
Volume Resistivity	25ºC	Ω·cm	≥10^14	≥10^14
Dielectric Strength	DC	KV/mm	≥15	≥15

Certifications

Packaging & Shipping

 

Our Advantages

1. We support OEM and ODM;
2.Timely response to your inquiry, multiple choice recommendations based on your demand, quickly respond mails and provide solutions;
3.Provide sample and trial order are accepted for the quality evaluation;
4.Arrange production on time and control quality strictly;
5. Book the earliest vessel or plane to guarantee the delivery time;
6. Provide all the detailed news and pictures from order to delivery;
Offer relative export documents and original certificate if needed;
7. Warm and considerable after-sale service.

FAQ

Q: How long is your delivery time?
A: Generally it is 5-10 days if the goods are in stock. or it is 15-30 days if the goods are not in stock or customeriziation, it is according to quantity.
Q: How about the payment terms?
A: T/T or L/C are okay. We can negotiate.
Q: How can you get quotation?
A: Please kindly send me your drawing with technical requirement and demand quantity.
If you don't have the drawing,please kindly courier samples to us.We will quote our best price as soon as possible.

Q: How about the shipping&package?

A: The package usually includes bubble wrap, carton, pallent, wooden case, etc. The shipping mode includes express, air and sea transportation. Both we can negotiate and choose the best way.